HARDSIL® is the patented technology by our partner Vorago Technologies. Discover here a cost-effective modification that fits seamlessly into the existing foundry process & design flows.
Definition HARDSIL® technology
HARDSIL is a patented, node-, foundry- and product-agnostic solution. Utilizing a few additional implant modules based on standard fab equipment allows the fabrication of Rad-Hard electronic components. Specialized design libraries or major process modifications are not necessary, allowing foundries to transparently re-use existing IP, design libraries and flows. HARDSIL easily incorporates exceptional Rad-Hard capability into standard semiconductor IC creation. Compared with Radiation Hardened by Design (RHBD) techniques, this technology does not require additional structures to deliver Rad-Hard performance. In fact, HARDSIL® immunizes semiconductor devices against high temperature or radiation-induced stresses. Consequently, the result is a reduced impact on power consumption, performance and die area.
HARDSIL is a cost-effective modification to commercial process flows that can be implemented quickly with minimal incremental mask and implant steps. In fact, traditional techniques require time and costly procedures, which typically limit the pool of quality components available that can operate in extreme temperature or radiation conditions.
VORAGO has developed multiple HARDSIL-based products for applications in Aerospace & Defense as well as in Industrial markets. In this way, customers can harden semiconductor devices against the effects of extreme temperature or radiation. Secondly, they no longer need to choose among a limited pool of existing components for their design, application and mission.
Innovative Rad-Hard solutions that fit seamlessly into existing foundry process & design flows
VORAGO offers a unique approach to radiation hardening in new and existing processes for foundries and partners that develop electronic components for aerospace, automotive, nuclear, medical facility, food and instrument sterilization environments.
In contrast to standard commercial design and manufacturing processes, high-reliability Rad-Hard electronic components must be designed and manufactured so that exposure to ionizing radiation and/or extreme temperatures does not result in malfunctions or catastrophic failure. In addition, VORAGO’s innovative technology does not require extensive design changes or retooling of a foundry’s manufacturing process to meet Rad-Hard requirements. As a result, this eliminates the need for costly and time-consuming adjustments or modifications.
HARDSIL Foundry Implementation
Foundry implementation of HARDSIL is accomplished using standard equipment and materials, seamlessly integrating into existing semiconductor manufacturing flows.
Additionally, HARDSIL integration utilizes the foundry’s existing equipment with design rules and scripts provided by VORAGO.
The HARDSIL Enabled Foundry: Design
NEW DESIGNS. Adding HARDSIL to new customer designs is accomplished at a fraction of the time and cost of other solutions. The VORAGO Standard Design Kit (SDK) provides additional physical design rules (DRC and LVS) and HARDSIL Mask Generation Algorithms for Tape-out.
EXISTING DESIGNS. Converting existing designs to Rad-Hard using HARDSIL does not require changes to designs, die sizes, specifications or yields. VORAGO provides layer creation and check scripts for add-on HARDSIL masks to efficiently transition existing designs.
Summary
Most commercial designs lack the additional design measures like TMR (Triple Mode Redundancy) SCRUB, EDAC or DICE latches to accommodate hardening results. VORAGO allows for ‘zero effort’ and no changes to original databases while still providing design-independent radiation hardness enhancements.
HARDSIL enables further Rad-Hard improvement because it can be easily combined with adjustments to the input database. The final output delivers a significant increase in TID, SEL and SEE performance beyond the original commercial specs
For any questions, please contact Dimac Red’s experts in Space applications at dimacred@dimacred.com
HARDSIL® is the patented technology by our partner Vorago Technologies. Discover here a cost-effective modification that fits seamlessly into the existing foundry process & design flows.
Definition HARDSIL® technology
HARDSIL is a patented, node-, foundry- and product-agnostic solution. Utilizing a few additional implant modules based on standard fab equipment allows the fabrication of Rad-Hard electronic components. Specialized design libraries or major process modifications are not necessary, allowing foundries to transparently re-use existing IP, design libraries and flows. HARDSIL easily incorporates exceptional Rad-Hard capability into standard semiconductor IC creation. Compared with Radiation Hardened by Design (RHBD) techniques, this technology does not require additional structures to deliver Rad-Hard performance. In fact, HARDSIL® immunizes semiconductor devices against high temperature or radiation-induced stresses. Consequently, the result is a reduced impact on power consumption, performance and die area.
HARDSIL is a cost-effective modification to commercial process flows that can be implemented quickly with minimal incremental mask and implant steps. In fact, traditional techniques require time and costly procedures, which typically limit the pool of quality components available that can operate in extreme temperature or radiation conditions.
VORAGO has developed multiple HARDSIL-based products for applications in Aerospace & Defense as well as in Industrial markets. In this way, customers can harden semiconductor devices against the effects of extreme temperature or radiation. Secondly, they no longer need to choose among a limited pool of existing components for their design, application and mission.
Innovative Rad-Hard solutions that fit seamlessly into existing foundry process & design flows
VORAGO offers a unique approach to radiation hardening in new and existing processes for foundries and partners that develop electronic components for aerospace, automotive, nuclear, medical facility, food and instrument sterilization environments.
In contrast to standard commercial design and manufacturing processes, high-reliability Rad-Hard electronic components must be designed and manufactured so that exposure to ionizing radiation and/or extreme temperatures does not result in malfunctions or catastrophic failure. In addition, VORAGO’s innovative technology does not require extensive design changes or retooling of a foundry’s manufacturing process to meet Rad-Hard requirements. As a result, this eliminates the need for costly and time-consuming adjustments or modifications.
HARDSIL Foundry Implementation
Foundry implementation of HARDSIL is accomplished using standard equipment and materials, seamlessly integrating into existing semiconductor manufacturing flows.
Additionally, HARDSIL integration utilizes the foundry’s existing equipment with design rules and scripts provided by VORAGO.
The HARDSIL Enabled Foundry: Design
NEW DESIGNS. Adding HARDSIL to new customer designs is accomplished at a fraction of the time and cost of other solutions. The VORAGO Standard Design Kit (SDK) provides additional physical design rules (DRC and LVS) and HARDSIL Mask Generation Algorithms for Tape-out.
EXISTING DESIGNS. Converting existing designs to Rad-Hard using HARDSIL does not require changes to designs, die sizes, specifications or yields. VORAGO provides layer creation and check scripts for add-on HARDSIL masks to efficiently transition existing designs.
Summary
Most commercial designs lack the additional design measures like TMR (Triple Mode Redundancy) SCRUB, EDAC or DICE latches to accommodate hardening results. VORAGO allows for ‘zero effort’ and no changes to original databases while still providing design-independent radiation hardness enhancements.
HARDSIL enables further Rad-Hard improvement because it can be easily combined with adjustments to the input database. The final output delivers a significant increase in TID, SEL and SEE performance beyond the original commercial specs
For any questions, please contact Dimac Red’s experts in Space applications at dimacred@dimacred.com
